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 SHINDENGEN
HVX-2 Series Power MOSFET
N-Channel Enhancement type
( F3W90HVX2 )
900V 3A
FEATURES Input capacitance (Ciss) is small. Especially, input capacitance at 0 biass is small. The static Rds(on) is small. The switching time is fast. Avalanche resistance guaranteed. APPLICATION Switching power supply of AC 240V input High voltage power supply Inverter
2SK2667
OUTLINE DIMENSIONS
Case : MTO-3P (Unit : mm)
RATINGS
Absolute Maximum Ratings iTc = 25j Item Symbol Tstg Storage Temperature Tch Channel Temperature VDSS Drain-Source Voltage VGSS Gate-Source Voltage ID Continuous Drain CurrentiDCj IDP Continuous Drain CurrentiPeak) IS Continuous Source CurrentiDCj PT Total Power Dissipation IAR Repetitive Avalanche Current EAS Single Avalanche Energy EAR Repetitive Avalanche Energy TOR Mounting Torque Conditions Ratings -55150 150 900 }30 3 6 3 65 3 48 4.8 0.8 Unit V A W A mJ Nm
Pulse width10Es, Duty cycle1/100
Tch = 150 Tch = 25 Tch = 25 i Recommended torque F0.5 Nm j
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
HVX-2 Series Power MOSFET
Electrical Characteristics Tc = 25 Item Symbol V(BR)DSS Drain-Source Breakdown Voltage IDSS Zero Gate Voltage Drain Current IGSS Gate-Source Leakage Current gfs Forward Tran]conductance Static Drain-Source On-]tate Resistance RDS(ON) VTH Gate Threshold Voltage VSD Source-Drain Diode Forward Voltage AEjc Thermal Resistance Total Gate Charge Qg Input Capacitance Ciss Reverse Transfer Capacitance Crss Output Capacitance Coss Turn-On Time ton Turn-Off Time toff Conditions
2SK2667 ( F3W90HVX2 )
Min. 900 1. 5 2. 5 Typ. Max. 250 }0. 1 Unit V EA S V
ID = 1mA, VGS = 0V VDS = 900V, VGS = 0V VGS = }30V, VDS = 0V ID = 1. 5A, VDS = 10V ID = 1.5A, VGS = 10V ID = 1mA, VDS = 10V IS = 1.5A, VGS = 0V junction to case VDD = 400V, VGS = 10V, ID = 3A VDS = 25V, VGS = 0V, f = 1MHZ ID = 1. 5A, RL = 100, VGS = 10V
2. 5 3. 5 3. 0 30 630 16 67 40 140
4. 7 3. 5 1. 5 1. 92 /L nC pF 70 230 ns
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
2SK2667
6 Tc = -55C 5
Transfer Characteristics
25C
Drain Current ID [A]
4 100C 3 150C 2
1 VDS = 25V TYP 0 0 5 10 15 20
Gate-Source Voltage VGS [V]
2SK2667
100
Static Drain-Source On-state Resistance
Static Drain-Source On-state Resistance RDS(ON) []
10 ID = 1.5A
1
0.1
VGS = 10V pulse test TYP -50 0 50 100 150
Case Temperature Tc [C]
2SK2667
6
Gate Threshold Voltage
5
Gate Threshold Voltage VTH [V]
4
3
2
1 VDS = 10V ID = 1mA TYP -50 0 50 100 150
0
Case Temperature Tc [C]
2SK2667
10
Safe Operating Area
100s 200s 1
Drain Current ID [A]
1ms R DS(ON) limit 10ms 0.1
DC
Tc = 25C Single Pulse 0.01 1 10 100 1000
Drain-Source Voltage VDS [V]
2SK2667
Transient Thermal Impedance
10
1
Transient Thermal Impedance jc(t) [C/W]
0.1
0.01 10-4 10-3
10-2
10-1
100
101
Time t [s]
2SK2667
100
Single Avalanche Energy Derating
Single Avalanche Energy Derating [%]
80
60
40
20
0
0
50
100
150
Starting Channel Temperature Tch [C]
2SK2667
10000
Capacitance
1000
Ciss
Capacitance Ciss Coss Crss [pF]
100 Coss
Crss 10
f=1MHz Ta=25C TYP 1 0 20 40 60 80 100
Drain-Source Voltage VDS [V]
2SK2667
Single Avalanche Current - Inductive Load
VDD = 100V VGS = 15V 0V Rg = 70 IAS = 3A
10
EAR = 4.8mJ
EAS = 48mJ
Single Avalanche Current IAS [A]
1
0.1 0.1 1
10
100
Inductance L [mH]
2SK2667
100
Power Derating
80
Power Derating [%]
60
40
20
0
0
50
100
150
Case Temperature Tc [C]
2SK2667
500
Gate Charge Characteristics
20
VDS
Drain-Source Voltage VDS [V]
VGS VDD = 400V 200V 100V 200
15
300
10
5 100 ID = 3A TYP 0 0 10 20 30 40 0 50
Gate Charge Qg [nC]
Gate-Source Voltage VGS [V]
400


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